Hynix Semiconductor, ProMOS Technologies, two big suppliers of dynamic random access memory (DRAM), on Thursday announced the signing of the strategic alliance agreement to strengthen their existing strategic alliance. Under the agreement Hynix will receive manufacturing capacities in exchange for process technology and will buy a stake in ProMOS.
“Hynix has always been recognized as one of the foremost technology leaders in global DRAM industry. This is particularly so in the case of the 50nm-class stack process technology. With the signing of the new strategic alliance agreement today, the relationship between Hynix and ProMOS will become much closer,” said Min-Liang Chen, chairman and president of ProMOS Technologies.
According to the Agreement, Hynix licenses to ProMOS 50nm-class DRAM stack process technology, while ProMOS offers to Hynix DRAM products made using the fabrication process from its 300mm fab capacity. To achieve timely technology transfer, Hynix plans to commence the government filing process immediately.
Additionally, Hynix plans to cooperate with some financial investors to buy 8%-10% portion of shares in ProMOS through private placement to strengthen their long-term cooperation relationship.
“Instead of being mere technology partner, Hynix will now become one of ProMOS’s major shareholders. I believe this synergistic relationship will be of great benefits to both companies and their respective customers,” added Mr. Chen.
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