Spansion?512Mb NOR Flash Memory Ships in Mobile Phone --- TheThirdMedia Hardware

Top French handset manufacturer relies on Spansion?MirrorBit?technology to enhance handset capabilities
SUNNYVALE, CALIF., June 13, 2005 ?Spansion LLC, the Flash memory venture of AMD (NYSE:AMD) and Fujitsu Limited (TSE:6702), today announced that top French handset manufacturer, SAGEM, has developed the SAGEM myX-8 mobile phone using the Spansion?S29GL512N Flash memory device ?the industry's only single-chip 512Mbit NOR Flash memory device in production.

As the only company in production today at this density, Spansion uses its advanced two-bit-per-cell MirrorBit?technology to deliver the industry's highest density NOR Flash devices on the market. The new SAGEM myX-8 device, available today in Europe, features 40 megabytes of built-in, user-accessible memory, allowing users to access digital music and video, run JAVA applications and games, and store photos captured by the integrated 1.3-megapixel camera.

?The SAGEM myX-8 phone is a perfect example of how Flash memory innovation is helping to drive exciting improvements in mobile handsets, and how cooperation works to accelerate this cycle,?said Amir Mashkoori, Senior Vice President and General Manager of Spansion's Wireless Solutions Division. ?By designing around a single-chip 512-megabit Spansion Flash memory product, SAGEM improved the user experience by expanding the amount of memory available for user-downloaded applications and multimedia content.?br />
About the Spansion?S29GL512N Flash Memory Device

The Spansion S29GL512N is the highest density product based on the company's advanced two-bit-per-cell MirrorBit technology. The S29GL512N is the most advanced member of the Spansion GL-N product family and combines expanded storage capacity with high performance and security to enable the next generation of home and automotive electronics, telecom and networking equipment, and mobile devices. The GL-N family also includes compatible 256- and 128-megabit devices to aid customers who design numerous products based on a single platform. Software, pinout and package compatibility across densities allows designers to upgrade, cost-reduce or otherwise modify existing products quickly and easily, without redesigning circuit boards and re-architecting software.



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