Nvidia Corp., the world’s largest supplier of graphics processing units, has joined the SOI Industry Consortium. Joining the organization may mean that the fabless developer of semiconductors is looking forward to design chips that will be made using silicon-on-insulator technology.
“Nvidia is pleased to join the SOI consortium. We are looking forward in participating on the advancement of such an innovative technology and its applications to future products,” said John Chen, vice president of technology and foundry operations at Nvidia.
Even though Nvidia is a fabless developer, hence, does not operate its own fabs, it is tremendously interested in rapid development of chip manufacturing technologies and design tools so that to be in position to continue creating leading-edge graphics processing units as well as other chips.
The SOI Industry Consortium, which was formed in October 2007 by a group of companies from across the electronics industry, is aimed at accelerating silicon-on-insulator innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption.
Nvidia brings the SOI Consortium membership to twenty three companies. Other members include: AMD, Applied Materials, ARM, Cadence Design Systems, CEA-Léti, Chartered Semiconductor Manufacturing, Freescale Semiconductor, IBM, Innovative Silicon, KLA-Tencor, Lam Research, Magma Design, Samsung, Semico, Soitec, SEH Europe, STMicroelectronics, Synopsys, TSMC, Tyndall Institute, UCL and UMC.
The SOI Industry Consortium is open to any company, organization or academic institution with an interest in SOI.
Related news
- TSMC Predicts Chip Price Increase.
TSMC Anticipates Raising of Chip Prices - AMD's Plans to Build Fab in New York Are ?Moving Along?
AMD Still Intends to Build a Fab in the USA - TSMC Has No Concrete Plans to Build 450mm Fab ?Company.
TSMC Claims There Are No Definite Plans for 450mm Factory - AMD Improves Chip Manufacturing Efficiency.
AMD Highlights Efficiency of Operations - Intel, Samsung Electronics and TSMC to Help Each Other in Transition to New 450mm Wafer Manufacturing.
Intel, Samsung and TSMC to Start Transition to 450mm Wafers by 2012 - HP Invents ?Memristor?Element that Can Enable Energy-Independent Memory, Human-Like Thinking Computers.
HP Labs Proves Existence of New Basic Element for Electronic Circuits - Expect ?Consolidations and Restructuring?in Semiconductor Industry: UMC's Chairman Emeritus.
UMC's Chairman Emeritus Expects Acquisitions and Mergers in Semiconductor Business
