AMD and IBM stress silicon wafers for better performance --- TheThirdMedia Hardware

AMD and IBM stress silicon wafers for better performance :



	TheThirdMedia Hardware → Other HD Guide → Other HD News > AMD and IBM stress silicon wafers for better performance

AMD and IBM stress silicon wafers for better performance

Date: 2005-12-10

[Abstract]
The AMD/IBM partnership is bearing some fruit; "strained silicon" for 65nm promises better performance for processors.AMD and IBM are starting to produce "stressed silicon" by using a...

[Content] PC Digital Mobile Game
The AMD/IBM partnership is bearing some fruit; "strained silicon" for 65nm promises better performance for processors.

AMD and IBM are starting to produce "stressed silicon" by using a layer of Silicon-Germanium to force the silicon atoms to be further apart than they would be without that layer. After the silicon lattice has been stressed, the Silicon-Germanium layer is removed, but the silicon retains its stressed shape - the insulator layer helps preserve the wider spacing

This technique apparently improves the electron flow.

[ Remark ] [ Print ] [ Font: Large Standard Small ]

Last News: Panasonic produces 50GB Dual Layer Blu-Ray disc
Next News: Taking a Stab at Nintendo Revolution Tech Specs, Pricing