Intel Readies Volume 45nm Manufacturing in 2008 :
  TheThirdMedia HardwareOther HD GuideOther HD News > Intel Readies Volume 45nm Manufacturing in 2008

Intel Readies Volume 45nm Manufacturing in 2008

Date: 2005-12-2

[Abstract]
   Intel Corp. said on Thursday that it plans to build a new wafer fabrication facility at its site in Kiryat Gat, Israel. The new factory, designated Fab 28, will extend Intel's manufacturi...

[Content] PCDigitalMobileGame

Intel Corp. said on Thursday that it plans to build a new wafer fabrication facility at its site in Kiryat Gat, Israel. The new factory, designated Fab 28, will extend Intel's manufacturing abilities by producing microprocessors using 45nm process technology in the second half of 2008. Construction on the $3.5 billion project is set to begin immediately.

“Our manufacturing network is a strategic asset of unmatched scope and scale that gives Intel the ability to provide customers with leading-edge products in high volume. Today's announcement of a second 45nm high volume factory reaffirms that Intel platforms will contain the most advanced and innovative technology in the world for years to come,?said Paul Otellini, Intel president and chief executive.

When completed, Fab 28 will become Intel's seventh 300mm wafer facility. The structure will include approximately 200 000 square feet of clean room space. Over the next several years the project will create more than 2000 Intel jobs at the site. The Israeli government is providing financial incentives for the new facility.

Intel currently operates five 300mm fabs which are located in Oregon, Arizona and New Mexico in addition to Ireland where an expansion of Intel's 300mm capacity in Ireland (Fab 24-2) is scheduled to begin operations in the first quarter of next year. In July Intel announced plans to invest more than $3 billion to build another 300mm fab, Fab 32 in Chandler, Arizona. The Fab 32 will also make chips using 45nm process technology, but will begin in the second half of 2007, months earlier compared to the Fab 28.

Manufacturing with 300mm wafers (about 12 inches in diameter) dramatically increases the ability to produce semiconductors at a lower cost compared with more commonly used 200mm (eight-inch) wafers. The bigger wafers lower production cost per chip while diminishing overall use of resources. Using 300mm manufacturing technology consumes 40 percent less energy and water per chip than a 200mm wafer factory. Intel's 45nm technology, which will first be put in high volume production at Fab 32, will allow chip circuitry to be built at about half the size of today's standard 90nm technology.

Related news

  • AMD to Help India to Build Semiconductor Foundry.
    Microprocessors to Be Made in India
  • TSMC Preps 80nm Process Technology ?Rumours.
    TSMC Readies Optical Shrink for 90nm Process Technology
  • NEC, Toshiba to Jointly Develop 45nm Process Technology.
    NEC and Toshiba to Share Semiconductor Process Development Expenses
  • AMD, IBM Confirm Extension Process Technology Research Pact.
    AMD, IBM to Co-Develop 32nm, 22nm Fabrication Processes
  • Intel Upgrades New Mexico Manufacturing Site.
    Intel's Fab 11X to Receive Additional 300mm Capacities
  • Freescale Ready to Prototype 65nm Devices.
    Freescale Preps to Test 65nm Process Technology
  • TSMC Tests 65nm Process Technology Production.
    Taiwanese Semiconductor Maker Tests New Process Tech


[ Remark ] [ Print ] [ Font: Large Standard Small ]

Last News: Nintendo to Spill Revolution's Guts Next E3
Next News: Owners of Viiv PCs Set to Get Additional Services

Search News



 
Class Title
Home Page (0)
CPU Guide (959)
Chipset Guide (193)
Memory Guide (472)
Mainboard Guide (464)
Video Guide (1339)
Storage Guide (410)
Multimedia Guide (736)
Mobile Guide (492)
Other HD Guide (2471)
Other HD News (1841)
Other HD Article (630)
 
Hot News
     
     
      >> Remark List   [Total 3 Remarks]
     
    Post Remark


    Remark: Letters0
    Name:   


      >> Related News      
     Intel Keeps Planning 450mm Wafer Fabrication Plants  (2005-12-03)
     Sales of Notebooks Surpass Sales of Desktops on “Black Friday  Thurs...  (2005-12-03)
     Intel Confirms Fabrication Technology Roadmap  (2005-12-03)
     Intel, SiS, VIA Lose Ground in Chipset Market  (2005-12-02)
     Apple's Mac Mini with Intel Processor Set to Acquire New Features  (2005-12-01)
     News com: AMD Dual Core's knock out Intel dual cores  (2005-12-01)
     Neoseeker Giveaway: Intel Pentium-D 830 and ECS 945 motherboard  (2005-11-30)
     When Two Become One: Intel Centrino Meets Fashion Design  (2005-11-29)
     Intel Fab 18 Factory Tour Posted  (2005-11-29)
     Intel to Use 90nm Fabrication Process for Chipsets  (2005-11-26)
     Intel's Xeon Chips Set to Acquire 1333MHz Bus  (2005-11-26)
     Intel Sponsors Cyberathlete Professional League World Tour Grand Finals  (2005-11-24)
     AMD to Follow Intel's Viiv, Debut Its Own Brand  (2005-11-23)
     Intel and Micron to Join Flash Efforts  (2005-11-22)
     NVIDIA Says Intel 975X Does Not Support SLI Multi-GPU Technology  (2005-11-22)
     Intel reveals Yonah core speeds  (2005-11-22)
     Intel Yonah to Be Called “Core Duo?- New Brand to Be Introduced  (2005-11-17)