Wind tunnels aren't new to PC enclosures; they've been employed by OEMs like Dell and HP/Compaq to provide optimal cooling performance in rack mount servers. Front-to-back airflow is also a key component of BTX designs. While the TJ06 is not a rack mount or BTX case, it attempts to take advantage of a wind tunnel's potential cooling benefits while retaining ATX compatibility. 
The TJ06's wind tunnel uses a large piece of clear plastic to isolate air flowing from the case's front 120 mm intake fan to its rear 120 mm exhaust from the rest of the system. The tunnel has a cutout for one of two accompanying inserts. For most motherboards, the flat insert pictured above should be fine. SilverStone also includes a larger arched insert (pictured below) that should accommodate some dual-processor motherboards and give the ATX power connector a little more room. 
Ideally, the TJ06's 120mm wind tunnel fans can create enough air flow across a processor's heat sink to eliminate the need for a dedicated processor fan. SilverStone even offers an NT01 v2.0 passive LGA775/S478 and S754/939/940 heat sink designed specifically for the wind tunnel. Unfortunately, the NT01 v2.0 wasn't ready in time for this review, but that didn't stop me from doing a little experimenting on my own.Initially, I tried using a Thermaltake Silent 775 with its fan removed to cool a Pentium 4 3.4GHz Extreme Edition processor with just the wind tunnel's airflow. At idle, CPU temperatures settled at a reasonable 53C, and rear noise levels dropped below 50dBA, the lowest my noise meter will go. However, under load, the processor's temperature rose steadily to over 75C, which would invoke throttling, so the experiment was aborted.
I attempted the same experiment with a 130-nm Athlon 64 3200+ and a Coolermaster Vortex Dream cooler with its fan removed. Things were fine at idle, but the system crashed under load.My initial experiments suggest that the TJ06's wind tunnel is incapable of adequately cooling standard processor heat sinks. However, most standard heat sinks sit too low to catch much air in the wind tunnel, and their cooling fins won't necessarily be oriented to take best advantage of the tunnel's front-to-back airflow. Taller heat sinks with fins in-line with the wind tunnel's airflow stand a much better chance of keeping a processor cool.
